Testing these components is a big challenge for test engineers, since currents and voltages have been rising rapidly in the last few years and will continue as such going forward.
To cut excess costs in mass volume production, these tests have to be done at different steps in the process, from front-end wafer level, bare-die, to back-end, where the discrete component and final product is tested. On one hand, this is mandatory to ensure consistently high quality and reliability of the devices. On the other hand, it is also important to detect failing parts as soon as possible – avoiding continuous processing of failed parts, and therefore lower production costs. The best cost-saving results can be achieved if you are able to completely cover test specification in every process step. For the most part, this isn’t easy.
Whitepaper link:
Cost-reduction and simplification: 1000A high current RDS(on) static parameter DC testing
vs. pulse testing @ 300μs
If you are faced with the challenge of having to implement a static or dynamic test system in your production cycle, we will be happy to assist you.
Contact us.
RDS(ON)Test System at the Electronica with tester
