Welcome to electronica 2026

Every new generation of Si, SiC and GaN devices sets new standards for voltage, current and switching speed. Your test equipment has to keep up. That’s why we develop test systems that go beyond today’s requirements, so your next device never hits the limits of what can be tested.
At electronica 2026, discover test solutions for every stage of your production, from wafer test to final module test. We support you along the entire semiconductor value chain, with a focus on Si, SiC and GaN power semiconductors: from wafer and known good die to discrete packages and modules. With our application expertise, we find a solution even for the trickiest test challenges.

Have a specific question? Book a meeting with our experts at the booth now.

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Every device places its own demands on testing. A wafer needs different contacting than a single bare die, a TPAK or a module, along with its own specific tests and parameters.
At three stations, we show application examples along the value chain, each with the device and the matching contacting solution. Our application experts will explain on site what matters most in each of these tests. Above all, they’ll take time for your own test challenge: bring your questions, and we’ll work out together how to solve them.

Book a meeting with our experts!

Nov 12, 2026 | 16:30 – 17:00 h | Hall A5, booth A5.260

Test cost is one of the biggest challenges in SiC and GaN power semiconductor manufacturing, and test speed is the strongest lever to reduce it. In his talk, Alexander Loibl shows that the decisive factor is the software architecture of the test system. Its four pillars are resource management, path finding, parameter handling and the test program itself. Combined in a multithreaded approach, they unlock significant gains in test speed and lower test costs.

Don’t miss this talk and gain valuable insights into an exciting topic.
And if you’d like to dive deeper into the topic, we’d be happy to continue the conversation at our booth.