June 18, 2026

PCIM 2026: Wide Bandgap Testing Takes Center Stage

PCIM 2026 is behind us — and it made one thing clear: wide bandgap semiconductors are where the industry’s attention is focused. SiC and GaN are reshaping power electronics with higher voltages, faster switching speeds, and smaller form factors. And with that comes a growing demand for device qualification that actually keeps pace.
KGD testing — Known Good Die — is the industry’s answer: every bare die electrically verified before packaging, before it ever makes it into an EV inverter, an industrial drive, or a renewable energy system. No surprises downstream.
Our dynamic test system DTS8765neo is built for exactly this challenge: up to 3,000 V, 20,000 A, test times down to 200 ms, and parasitic inductance as low as 5 nH — the parameters that matter when running Double Pulse Tests and Short Circuit Tests without putting your sample or test fixture at risk.
At our booth, those specifications opened the conversations that count: technically engaged visitors, substantive discussions, and follow-ups we are genuinely looking forward to.
Two moments stood out beyond the booth itself: our colleague Alexander Loibl presenting an interesting lecture on “Pico and Kiloampere Measurements in Milliseconds” on the Technology Stage – a strong platform for a strong topic – and our presence at the ECPE joint booth, a network that continues to bring real value to the industry.
A sincere thank you to our show team for making it all come together, and to our partner Cohu for their support with a SiC HV Power Probecard and a Power KGD Probehead. Great collaboration on the floor.