May 18, 2026
Next Level High Power WBG Semiconductor Testing at PCIM Europe 2026
We are pleased to announce our participation in PCIM Europe 2026, one of the leading international events for power electronics, intelligent motion, renewable energy and energy management.
Visit us in Hall 4, Booth 305 and discover how advanced test technology helps manufacturers and suppliers meet rising demands in SiC, GaN and high power semiconductor applications.
Focus on Performance Across the Entire Test Chain
Wide bandgap semiconductors are driving the next generation of efficient power electronics. At the same time, they create new requirements for characterization, validation and production testing.
Our trade fair theme reflects this challenge:
Next Level High Power WBG Semiconductor Testing
At PCIM, we will demonstrate how modern test systems can support the complete semiconductor value chain with one scalable platform, from early wafer level testing through to final power module verification.
Our Exhibition Highlights
STS8760neo
Static semiconductor test system for precise electrical characterization, parameter measurement and production related test tasks.
Technical Highlights: up to 3000 V | 2400 A | pulse length down to 100 μs | accuracy down to pA resolution
DTS8765neo
Dynamic semiconductor test system for switching analysis, transient behavior and testing under realistic load conditions.
Technical Highlights::up to 2000 | 20000 A, short test times < 500 ms | parasitic inductance ≥ 5nH
- Both systems are designed for users who need:
- high measurement precision
- fast test throughput
- stable and reproducible results
- scalable integration into existing processes
- flexibility for future device technologies
One System Concept from Wafer to Power Module
Many manufacturers operate separate test environments for different process stages. This often increases complexity, interfaces and effort.
Our approach is different:
One coordinated system platform that supports testing from:
- wafer level
- KGD
- discrete semiconductor devices
- packaged components, e.g. TPAK
- power modules
This helps reduce process friction while improving data consistency and operational efficiency.
Meet Our Team in Nuremberg!
Whether your focus is throughput, yield improvement, measurement repeatability or readiness for next generation SiC and GaN devices, we would be glad to discuss your requirements.
Visit us at Hall 4, Booth 305.
